The global AI infrastructure boom is fueling a race to expand advanced chip packaging capacity, with capital spending expected to approach $28 billion in 2026, according to Yole Group. Advanced packaging revenue is forecast to overtake traditional packaging for the first time. TSMC dominates the key CoWoS technology, and its capacity limits have pushed Nvidia, AMD and others to seek new suppliers.
AI boom drives $28 billion race in chip packaging
Source: Moneycontrol